Fellow Wizards,

Occasionally, I am asked to reflow BGAs already placed because tests
suspects a solder problem.  Sometimes reflowing does fix suspected problems
so who can argue.

We have a AIR VAC DRS-24 BGA rework station which has worked very well.  I
have been using Kester's TSF-6522 tacky flux for new placements and liquid
RMA for reflows. Reflows require getting flux under a BGA which is not easy
for the larger packages.

What I would like to know is what type of tacky flux is commonly used by my
colleagues for new BGA placements, and what type of flux is commonly used
when a reflow is required?  What is the success rate for reflows?

Look forward to hearing from .........   thanks

joe

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