I have placed several BGA packages with vary good success but I do not have experience with this package, "1000 Pin PBGA .5mm pitch (25mmx25mm)". This is a new component and I don't have all the data, like ball size and ect. The board will be six inches square and .063" thick.
My main concern is, has anyone with this type of machine placed successfully this type of package using an IP II. Thanks in advance for any input in this matter.
Scott.
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