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April 2003

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 4 Apr 2003 18:55:09 +0300
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How about a high MP solder on one pin and a soldering iron? Much easier
than having to wait for an adhesive to cure -- and the adhesive may not
take nicely to being heated to soldering temp after cure.

Brian

Kevin Syverson wrote:
> Good Morning TechNetters,
>
>
>
> I am curious if anybody has experience using conductive
> epoxies/adhesives to prevent movement of heavy surface mount devices
> during reflow (convection oven, oxygen atmosphere).  We have some heavy
> double-stacked ceramic capacitors in a 20 pin DIP package (J-lead
> configuration) that stand off the circuit board approximately 0.125?,
> which pretty much precludes the possibility of using a standard SMT
> epoxy for securing the body of the component to the board (at least I
> think so).  The components have very narrow terminations with much
> larger (wider and longer) board lands, and the parts are shifting off
> the pads a bit during reflow.  We are using OA solder paste (Alpha
> WS609) and I would like to replace the paste on two opposing leads with
> something to help secure the component during reflow.  Does anybody have
> any experience or maybe some other ideas for this?
>
>
>
> Thanks,
>
>
>
> Kevin Syverson
>
> Silicon Forest Electronics
>
>
>
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