Sounds about right to me.
Peter
"Dehoyos, Ramon" <[log in to unmask]> 29/04/2003 12:47 AM
Sent by: TechNet <[log in to unmask]>
Please respond to "TechNet E-Mail Forum."; Please respond to "Dehoyos,
Ramon"
To: [log in to unmask]
cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Subject: Re: [TN] Component Prep
Can not give a specific document number, but the rule where I have
worked has been 0.100 off the board for THT components of a 1 Watt or more.
The rest may be flush with the board, which are the majority.
Regards,
Ramon
> -----Original Message-----
> From: Barbara Sillanpaa [SMTP:[log in to unmask]]
> Sent: Monday, April 28, 2003 11:24 AM
> To: [log in to unmask]
> Subject: [TN] Componet Prep
>
> Does anyone know of a component standard for the "crimping" or "standoff"
> requirements for the following parts.
> Thermistors
> Capacitors
> Varisitors
> Resistors
> We currently Hand Crimp 95% of these parts, and were wondering now,,,Why
> are we doing this. Any feedback is greatly appreciated.
>
>
> Barbara Sillanpaa
> Manufacturing Trainer
> Tyco Safety Products
> 100 Simplex Drive
> Westminster, Ma 01473
> 978-731-6679
> [log in to unmask]
>
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