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April 2003

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Date:
Tue, 29 Apr 2003 07:49:03 +0800
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Hi, Dave,

If you insist on wave soldering, my answer would be to fill the BGA via
holes with conductive epoxy at the PCB Fab stage. That way, the holes are
filled and plated over, giving a solid pad for the test probes to hit on,
without the worry of filling the holes with solder and causing shorts.
Epoxy filling would also allow the board to be sucked onto the jig.

The only note of caution is that the epoxy MAY swell slightly when exposed
to wave soldering and spoil the flat finish, so you would have to try the
first on a few boards first to see how it goes. Otherwise, you're a bit
stuck on those dilema horns.

Good Luck,

Peter



Dave Chapman <[log in to unmask]>      28/04/2003 10:02 PM
Sent by: TechNet <[log in to unmask]>

Please respond to "TechNet E-Mail Forum."; Please respond to Dave Chapman

              To:  [log in to unmask]
              cc:  (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
              Subject: Re: [TN] BGA








Happy Monday, I have a BGA 256 Tundra which has no shorts in SMT (we
x-rayed
all 16 boards) When it goes over the wave we get a short or two. Please
assume the wave is in control.
We mask the topside of the BGA because there are a lot of vias which when
they test it would leak and not get pulled down good in the fixture. I need
the vias on the bottomside under the BGA to be filled with solder for
testing so I can't mask the bottom. What should I do?

Dave Chapman
Manufacturing Engineer
Circuit Service Inc.









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