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April 2003

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Mon, 28 Apr 2003 10:47:34 -0400
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Dave,
I believe IPC has a Tech report on different finishing againest steam
aging testing and solderability.  I believe it is also including the
storage infor as well.  Very old doc. I think.
                                                                 jk

>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Dave Hillman
>Sent: Monday, April 28, 2003 10:17 AM
>To: [log in to unmask]
>Subject: Re: [TN] Raw card solderability
>
>
>Hi Bill! I don't know of an IPC specification that designates
>a given period of shelf life for an of the available pwb
>finishes. The general consensus for shelf life of either
>components or pwbs within the JSTD-002 and JSTD-003 committees
>is one year. However, that one year figure is not a
>requirement. The shelf life of a specific pwb finish is
>negotiable between yourself and your pwb fabricator. Many of
>the pwb finishes types (immersion gold, immersion silver,
>immersion tin, HASL, OSP) can easily have one year shelf life
>when properly applied, properly handled and adequately stored.
>Also realize that some pwb finishes (e.g. thin OSP coating
>family) are not designed for one year storage. Good Luck.
>
>Dave Hillman
>JSTD-002/003 Chairman
>[log in to unmask]
>
>
>
>
>                      Bill Page
>                      <bill.page@SANMIN        To:
>[log in to unmask]
>                      A-SCI.COM>               cc:
>                      Sent by: TechNet         Subject:  [TN]
>Raw card solderability
>                      <[log in to unmask]>
>
>
>                      04/25/2003 03:48
>                      PM
>                      Please respond to
>                      "TechNet E-Mail
>                      Forum."; Please
>                      respond to Bill
>                      Page
>
>
>
>
>
>
>Consider this a hypothetical question :)
>
>We have some fabs that, due to reduced production
>requirements, have been in house for an extended period of
>time (more than a year).  In investigating some solderability
>concerns, the board house suggested that with thinner HASL
>coatings, copper migrates through the tin-lead coating,
>reducing solderability.  The vendor seemed to think that a
>six-month shelf life is now an industry standard...indeed, he
>involved the magic name of IPC.
>
>It has, admittedly, been a long time since I considered myself
>up to date on PCB fabrication issues.
>
>a. Is this a legitimate observation from our supplier?
>b. Should we expect only a six month shelf life on PCB?
>c. What rework method is recommended to bring these back in spec?
>
>Thanks,
>
>Bill Page
>
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