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April 2003

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From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 28 Apr 2003 16:38:05 +0200
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Hi Dave,

I don't understand what you mean by masking the topside of the BGA, but
for future designs my advice would be to use dedicated testpads on the
bottomside so you don't need filled via's anymore.
And how about changing the testneedles ?
As a third option, because I don't want to spoil your Happy Monday, I'd
say look at the bright side: 252 perfect solder joints per BGA !!

Regards,

Daan Terstegge
PCB Assembly Department
Thales Communications

Tel        +31(0)35 524 8297
Fax       +31(0)35 524 8181
[log in to unmask]
**This message is Unclassified**


>>> [log in to unmask] 04/28/03 04:02pm >>>
Happy Monday, I have a BGA 256 Tundra which has no shorts in SMT (we
x-rayed
all 16 boards) When it goes over the wave we get a short or two.
Please
assume the wave is in control.
We mask the topside of the BGA because there are a lot of vias which
when
they test it would leak and not get pulled down good in the fixture. I
need
the vias on the bottomside under the BGA to be filled with solder for
testing so I can't mask the bottom. What should I do?

Dave Chapman
Manufacturing Engineer
Circuit Service Inc.









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