I have a board to do that is incorporating a .8mm pitch BGA chip on it and I
am gathering info on the layout suggestions for that type of pad geometry.
Do any of you have experience with this type of layout challenge that you
would be willing to share?

There are suggestions out there that incorporate HDI 'via-in-pad' solutions
and others suggest 'Dog-boning' a .45mm [.018"] via pad with a .2mm [.008"]
plated thru hole in it. I would really like to hear from someone who has
done this successfully and also some of the problems they encountered.

Thanks in advance.


Bill Brooks, CID

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