Glenn,
Balls down in pocket tape is best for most equipment since this approach
does not require 'flipping' the device over to place it. Alternatively,
balls down in a properly sized waffle pack works too, since it becomes a
pocket tape array of sorts. Balls down in a gel pack sounds dangerous.
To me, the only 'problem' with waffle packs is that they require the
operator pay greater attention to handling. A waffle pack can be 'bumped'
while open and jumble the contents, whereas a pocket tape can be dropped
:-( and still have acceptable suitability.
Small quantity runs will likely employ waffle packs. Big runners may
warrant tape. What is your equipment capable of using?
Inspection can be difficult, but if your flip chip bonder has a 'missing
ball detection routine' during the alignment process, you can 'flip' the bad
die out. Perchance, if one gets buy, a missing ball will create an 'open'
circuit and should be caught during a functional test. But if it is merely
a mechanical bump that is missing, that might lead to subtle problems later.
Steven Creswick - Gentex Corp
-----Original Message-----
From: Glenn Pelkey [mailto:[log in to unmask]]
Sent: Thursday, April 24, 2003 2:17 PM
To: [log in to unmask]
Subject: [TN] Flip Chip Die Packaging
This question may be somewhat unique, but for those of you doing flip chip
assembly, how do you require the die to be packaged? Waffle Pack, Gel Pack,
surface up or down? There have been concerns about inspection, handling,
and placement of these die, depending on how they are received.
Thanks,
Glenn
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