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April 2003

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Subject:
From:
Glenn Pelkey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Apr 2003 11:16:58 -0700
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text/plain
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text/plain (20 lines)
This question may be somewhat unique, but for those of you doing flip chip
assembly, how do you require the die to be packaged?  Waffle Pack, Gel Pack,
surface up or down?  There have been concerns about inspection, handling,
and placement of these die, depending on how they are received.

Thanks,

Glenn

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