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April 2003

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Subject:
From:
Bill Christoffel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Apr 2003 08:24:37 -0500
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Long term reliability indeed is the issue, depending on environmental conditions this type of connection (in my experience) is prone to failure.  A lot depends on the epoxy being used.  Some are more aggressive (i.e.. Epotek H20E) and may work for the application but still not recommended.

Bill C.



-----Original Message-----
From: Dan R. Johnson [mailto:[log in to unmask]]
Sent: Wednesday, April 23, 2003 3:04 PM
To: [log in to unmask]
Subject: [TN] SOLDER/EPOXY REACTION


I have a customer who is trying to attach our SMT part to their hybrid
assembly using silver fill epoxy. We use a  lead free alloy (Sn 96.5/Ag
3.5).
Any body have any experiences in this area. The customer (actually the CM)
is worried about dissimilar metals and long term reliability, should they?
Thanks,
Dan

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