Hello all-

I am a member of a team attempting to reduce and potentially eliminate board
conditioning (baking) for high Tg FR4 boards at our plant sites.  I am
inquiring for input relating to current company trends, product basis, and
frequency of board baking prior to board assembly.  The implementation of
board baking requirements were historically based on delamination frequency
at particular plant site locations - no additional failure analysis was
pursued beyond the implementation of the baking schedule being applied to
all products.

I am looking for feed back for use in a manufacturing pilot that is being
designed for a plant site that currently bakes all PWB products.  Any and
all input would be appreciated for this effort.

Regards - Matt

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