Hi All,

Does anyone know where I can find information on air bubbles or voids within
completed circuit boards?  We have a group here which is concerned about any
voids left when the laminates are pressed together, either within or between
layers, and the effects they might have at high altitudes.

Are there any IPC specs which state allowable values or anything like that?
These are boards made with IPC-4101/ 40, 41 or 42 materials.

Thanks for any help!
Bill

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William G. Brown
Senior Electrical Engineer - PWD Engineering Support
> xBAE  SYSTEMSx - Information & Electronic Warfare Systems
Phone: 603-885-4930     Fax: 603-885-5435
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