Hello folks:

Received this comment from one of our customers and the problems they have
with boards that meet the warp and twist requirements of 600 but still are
problematic in the manufacturing operation. The equipment they use is state
of the art high volume type of equipment which is used by many people in the
industry.


We are looking for comments and facts relative to this happening with other
manufacturers, and whether or not enough information exists to request a
change to 600 and to provide product which is compatible to existing
manufacturing processes.


When we receive fabs for our complex SMT assemblies that are barely in spec.
We still cannot use them to build without great difficulty. From Screen to
reflow we have issues. Is anyone else wishful of a tighter spec? I can
require a .5 for our specific boards, but if I were to suggest .5 to IPC,
would I be unfairly restricting the fab houses?

Looking forward to your comments.

Leo Lambert
EPTAC Corp.
71 Route 101 A
Amherst, NH. 03031
603-673-7822
www.eptac.com,

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