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April 2003

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Subject:
From:
Kathy Kuhlow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 17 Apr 2003 08:01:03 -0500
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We do flex assembly.  The assembly process always utilizes a fixture to give support.  On most the Flex may include a rigid mounted substrate of the flex.  We have used small fine pitch devices but no BGA.  We have played with BGA's on flex assemblies but no production use.  We  have had really good results.  

Kat

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<!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN"> <HTML><HEAD> <META http-equiv=Content-Type content="text/html; charset=iso-8859-1"> <META content="MSHTML 6.00.2715.400" name=GENERATOR></HEAD> <BODY style="MARGIN-TOP: 2px; FONT: 8pt MS Sans Serif; MARGIN-LEFT: 2px"> <DIV><FONT size=1>We do flex assembly.&nbsp; The assembly process always utilizes a fixture to give support.&nbsp; On most the Flex may include a rigid mounted substrate of the flex.&nbsp; We have used small fine pitch devices but no BGA.&nbsp; We have played with BGA's on flex assemblies but no production use.&nbsp; We&nbsp; have had really good results.&nbsp; </FONT></DIV> <DIV><FONT size=1></FONT>&nbsp;</DIV> <DIV><FONT size=1>Kat</FONT></DIV></BODY></HTML> --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------

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