I think the ingrained fear of Black Pad is keeping it alive in people's
imaginations when I think it is now more a thing of the past - particularly
with reliable fab houses. Less relaible fab houses that take short cuts or
have poor process control may continue to churn out boards that suffer from
Black Pad - I don't know. Choose your fab shop wisely, I guess.
Peter
"d. terstegge" <[log in to unmask]> 02/04/2003 05:45 PM
Sent by: TechNet <[log in to unmask]>
Please respond to "TechNet E-Mail Forum."; Please respond to "d. terstegge"
To: [log in to unmask]
cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Subject: Re: [TN] Board Shop Audit (+ ENIG question)
Interesting suggestion. Boardvendors tell me that black pad problems are
something of the past, but with all the discussions I see on Technet and
elsewhere I doubt this is true. That's exactly the reason why I'm
searching for more technical background about the process.
Daan
>>> [log in to unmask] 04/02/03 11:31am >>>
Hy Daan
Very good question. I would be interested in the answers you get.
Not for an audit, but i would ask them:
How can you guarentee that your products are 100% "Black Pad" Free.
If they are honest they cant give you this guarentee, or they have to
tell
you dont use ENIG.
What is your opinoun?
Siggi
-----Original Message-----
From: d. terstegge [mailto:[log in to unmask]]
Sent: Mittwoch, 2. April 2003 11:23
To: [log in to unmask]
Subject: Re: [TN] Board Shop Audit (+ ENIG question)
Hi Technet,
Intersting thread about board shop audits this is. I want to add some
comments and a question:
Personally I think that besides a quality system (which must be
visible
as procedures, worker instruction and inspections) what matters most
is:
do they know their process. It's nice if the boardshop has perfect
control over a parameter X, but what if their target setting is plain
wrong. Like the boardshop I visited that had the HASL-airknives
adjusted
for maximum flatness, resulting in less than 1 micron of leadtin on
the
pads. It was controlled, it was documented, and the operator knew his
instructions, but 1 micron is just not thick enough for good
solderability....
My question: Can anyone tell me what are the most critical parameters
to investigate when auditing an ENIG process, or do you know a good
source of information about the specifics of this process ?
Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net
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