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April 2003

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From:
"Kasprzak, Bill (sys) USX" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 15 Apr 2003 10:41:23 -0400
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I'm looking for some general inputs on what others are doing with respect to
wave soldering SMD's.

I have an application that uses some active devices on the solder side. My
temptation is to wave solder the parts. The spec for the parts does not call
out wave soldering but does say that the terminals of the can be subjected
to 250C for 10 sec. Note that it says the terminals can be subjected to this
temp. I don't have a problem lowering my solder wave temp from 260C down to
250C but I wonder about the case of the part. The case is a JEDEC DO-214AB,
molded plastic over passivated junction. I think  that the molded plastic
probably indicates that it is not compatible with wavesoldering. The device
is a transorb.

I know that I posted this question before but, does anyone have success with
wave soldering ceramic caps larger than 1812's? All the specs I've looked at
talk about not recommending wave soldering due to the steep gradient
associated when moving from preheat to the wave itself. Can adjustments to
the process overcome this problem? I have some ideas about this but, I'd
like to hear what others are doing.

We are working to J-Std-001C, class 3. Thanks for your help.

Bill Kasprzak
Moog Inc. Manufacturing Engineering, Electronics

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