Any of you guys know how to measure board warpage after the unit has been completely process?

Process:
SMT Bottom
SMT Top
PTH Axial and Radial
Hand loaded
Wave Solder
Post wave processing

 At my Incoming receiving area I can detect board warpage but after the wave process (sometimes SMT Top) the boards start to warp. All the profiles have been verified and validated. 
 We know we have a vender issue but the problem is our customer will not accept the unit we have in process (around 500). So if anyone has any suggestions it would be greatly appreciated.

Carl Ray
Sr. Manufacturing Engineer
Huntsville, AL 35807
Phone: 256-882-4800 ext. 8845
Cell: 256-990-1990

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