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April 2003

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Subject:
From:
Ted Kong <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 14 Apr 2003 09:14:22 -0700
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Hi Don,

What stencil thickness and opening were used?  My
suggestion is to bake the part before you put them on.

Ted
--- Don_well <[log in to unmask]> wrote:
> Hello all
>     A 1.27mm pitch BGA connector(300Pins 10Lines)
> was assemblied on a flex board.The NSMD pad size is
> 0.65mm and the assembly area is strengthened by a
> 2mm rigid FR4 board.We pilot run 10 pieces of board
> and found 100% BGA connector bridging.Bridging
> ,bridging and also bridging.Can you tell me why??
>
> B.regards
>
> Don
> Huawei
>
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