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April 2003

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Subject:
via filling
From:
An <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 14 Apr 2003 05:58:55 -0500
Content-Type:
text/plain
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text/plain (22 lines) 
Hello,
I'm searching for information on filling of burried vias, blind vias, and
micro-vias. The more information I can find the better.
Which technology is available? Conductive or non-conductive? Plating or
screen-printing?  Which suppliers?
Which process do you use? How are your experiences with it? For which
purposes do you fill?
I thank you in advance.
Sincerely
An gielen

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