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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 1 Apr 2003 15:09:53 +0200 |
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I would think that there are more problems with CSP, because the bedewing
will be preffered under the device.
The Moisture will be stored there even if humidity is reduced.
Just a thought
Siggi
-----Original Message-----
From: Guenter Grossmann [mailto:[log in to unmask]]
Sent: Dienstag, 1. April 2003 14:26
To: [log in to unmask]
Subject: [TN] CSP 0.8 and humidity
Got a question from a manufacturer who used QFP's 0.5 in an application
where high humidity and bedewing are considered possible (no coating). The
people there want to use CSP 0.8 now instead of the QFP's and asked me
whether I see any problem in the use of the CSP's. My first thought was that
if there was no problem with the QFP's I couldn't see any in using CSP's.
Any information from around the world?
Best regards
Günter
EMPA
Swiss Federal Institute for Materials Testing and Research
Centre for Reliability
Guenter Grossmann, Senior Engineer
8600 Duebendorf
Switzerland
Phone: xx41 1 823 4279
Fax : xx41 1823 4054
mail: [log in to unmask]
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