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April 2003

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Tue, 1 Apr 2003 13:26:59 -0500
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http://www.chipscalereview.com/issues/0303/standards.php
You have to check with your supply.  
                                                                      jk

>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Zweigart, Siegmund
>Sent: Tuesday, April 01, 2003 8:10 AM
>To: [log in to unmask]
>Subject: Re: [TN] CSP 0.8 and humidity
>
>
>I would think that there are more problems with CSP, because 
>the bedewing will be preffered under the device. 
>The Moisture will be stored there even if humidity is reduced.
>
>Just a thought
>
>Siggi
>
>-----Original Message-----
>From: Guenter Grossmann [mailto:[log in to unmask]]
>Sent: Dienstag, 1. April 2003 14:26
>To: [log in to unmask]
>Subject: [TN] CSP 0.8 and humidity
>
>
>Got a question from a manufacturer who used QFP's 0.5 in an 
>application where high humidity and bedewing are considered 
>possible (no coating). The people there want to use CSP 0.8 
>now instead of the QFP's and asked me whether I see any 
>problem in the use of the CSP's. My first thought was that if 
>there was no problem with the QFP's I couldn't see any in 
>using CSP's. Any information from around the world?
>
>Best regards
>
>
>Günter
>
>EMPA
>Swiss Federal Institute for Materials Testing and Research 
>Centre for Reliability Guenter Grossmann,  Senior Engineer
>
>8600 Duebendorf
>Switzerland
>
>Phone: xx41 1 823 4279
>Fax :     xx41 1823 4054
>mail:     [log in to unmask]
>
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