Hi there,

One of our customers has put a SRAM (TSOP-54   NEC)  on the bottomside of a
board.
It is necessary to wavesolder this side so we have to glue this component
along with the other smd's
The problem is that these components are very susceptible for boardhandling
and fall off the board to often before the wavesolderprocess.
In one way or another the adhesion is not as strong as with "normal"
components.
In the past we had the same problem with similar shapes from different
manufacturers.
Luckily we were able to solve those problems.
And I think we can solve this one in the same way.

What then is  your problem, I hear you thinking.
It looks to me that these components are not really designed for
(glueing,curing and) wavesoldering.
And I'm looking for some sort of proof or testresults.
Wether I'm right or wrong, I just would like to know.



Jowan Iven



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