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April 2003

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Subject:
From:
Rick Thompson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Apr 2003 09:45:32 -0700
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We have a customer who had a custom BGA built with some additional components besides the die under the encapsulant. Unfortunately, these parts were soldered with Sn63Pb37 and the solder reflows and bridges under the encapsulant during reflow.  Due to time constraints they would like to find a way to use these while they wait for new parts to be fabbed.  We've tried various types of shielding, but the convection systems we have heat the entire part causing the internal reflow.  Does anyone know of a focused reflow system that would allow reflowing the eutectic balls of a BGA but not apply enough heat to the top of the component to reflow the other parts?  Would one of the focused IR systems (Ersa, PDR) do this?  Other possibilities?

Thanks in advance.

Rick Thompson

Sr. SMT Process Engineer
SMTEK International, Inc.
+1 (805) 532-2800
[log in to unmask]

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