Thanks Siggi.
But (oops) I forgot to mention that this FPC is used in a high vibration environment (instantaneous acceleration beyond 10Gs). Are there any gotchas with this app? Is this mat'l something similar to the "bendflex" stuff Rogers used to make or still makes? Can it withstand radii of 1.5-3mm?
TIA (couldn't resist),
Roger M. Stoops, CID
Trimble Navigation Ltd., Dayton, OH, USA
Ph: 937.233.8921 or 937.233.4574 ext 288
Fax: 937.233.7511
-----Original Message-----
From: Zweigart, Siegmund [mailto:[log in to unmask]]
Sent: Wednesday, April 23, 2003 4:05 AM
To: [log in to unmask]
Subject: Re: [TN] Cost Comparison of Flex Circuit Mat'l
Hello
Did you also look into this semi flex material?
In this case the flex part is made of thin FR4.
It seems to be cheaper than the Polyimide solution and it is not
hygroscopic.
The material is rated for 5 to 10 bending cycles (should be enough for
mounting)
Siggi
-----Original Message-----
From: Roger Stoops [mailto:[log in to unmask]]
Sent: Dienstag, 22. April 2003 22:26
To: [log in to unmask]
Subject: [TN] Cost Comparison of Flex Circuit Mat'l
Dear all,
I guess there are two basic types of Cu-clad polyimide: Cu-clad polyimide
with adhesive and adhesiveless Cu-clad polyimide. I am curious as to the
relative cost of each, and the advantages or limitations of using either
one. The end use is Class 2, Type 5A (flex to install), in a (fairly)
sealed enclosure that will see temps of -20C to +85C. Only two copper
layers, no plated holes.
In the past our FPCs have always been of the Cu-adhesive-polyimide type.
I want to know if there would be any advantage to using the adhesiveless
stuff, besides thinner circuits.
Cordially,
Roger M. Stoops, CID
Trimble Navigation Ltd., Dayton, OH, USA
Ph: 937.233.8921 or 937.233.4574 ext 288
Fax: 937.233.7511
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