Franklin,

Thickness is usually defined by customer as well as where the measurements
are to be taken. It may state glass to glass, metal to metal or mask to
mask.

Scott B. Westheimer
General Manager,
Gultech North Carolina
5800 McHines Place
Raleigh, North Carolina 27616
Phone: (919)872-0100
Fax: (919)713-4849
Cell: (919)649-1510
Toll Free: 1-866-gultech
[log in to unmask]
Web Page: www.gultechna.com
----- Original Message -----
From: "Franklin D Asbell" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, March 03, 2003 9:49 AM
Subject: [TN] PC Board thickness measurement


> In what IPC specification is board thickness measurement (location)
> referenced?
>
> I'm looking for where overall thickness is mentioned. I'm receiving
> conflicting information on whether the required board thickness is to be
> measured over foil copper (multilayer, after layup), over
soldermask/glass,
> or over final finish.
>
> And is there information differentiating between OSP or flat coatings and
> HASL or reflow if final thickness is measured over...final finish...
>
> Thanks.
>
> Franklin
>
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