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March 2003

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Subject:
PC Board thickness measurement
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 3 Mar 2003 08:49:23 -0600
Content-Type:
text/plain
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text/plain (26 lines) 
In what IPC specification is board thickness measurement (location)
referenced?

I'm looking for where overall thickness is mentioned. I'm receiving
conflicting information on whether the required board thickness is to be
measured over foil copper (multilayer, after layup), over soldermask/glass,
or over final finish.

And is there information differentiating between OSP or flat coatings and
HASL or reflow if final thickness is measured over...final finish...

Thanks.

Franklin

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