Hi, Paul,
If I were give the choice, I know which option I would go for - the QFP.
Board space required to locate the QFP and its associated fan-out is
greater, but if the design can afford the real estate, go for it.
Points in favour are:
- No need to X-ray in order to inspect joints
- More 'flexible' than BGA's (better strain relief), therefore more
resistant to creep fatigue.
- No need to underfill (if you do).
- PCB Flatness criteria not quite so vital.
- Rework is quicker and cheaper (especially if BGA is underfilled)
- Fewer long-term reliability issues (no cracked balls, if you'll pardon
the expression)
- Thermal profiling is easier.
- etc.
Points against:
- QFP's take up more board space than BGA's.
- They don't self-align as well as BGA's do during reflow.
Peter
"Black, Paul" <[log in to unmask]> 07/03/2003 07:22 AM
Sent by: TechNet <[log in to unmask]>
Please respond to "TechNet E-Mail Forum."; Please respond to "Black, Paul"
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cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
Subject: [TN] BGA vs. QFP
Hi Technetters,
Up until now, I have been spoiled in that the only BGA that I have had to
deal with had a 1.25mm pitch. Now, for a new design, Engineering is giving
me an option of a 64 pin BGA or QFP. Both have a pitch of 0.5mm; is the
consensus to stick with the BGA? Are there any potential gotcha's?
Thank you,
Paul Black
Manufacturing Engineer
Kronos
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