Hi all,

We have a couple of products that have come our way that are
designed for glue-on-wave (i.e. 0805; SOT23 and some SOIC's)
being glued at SMT and then flow-soldered in-amongst a whole
lot of through-hole leads (500 leads on one of the assemblys).

Clearances round the PTH leads make a pocketed flow-solder
pallet not possible.

1) What manufacturers of glue do you guys recomend/use??
2) Does anyone use stencil printing of the glue onto the
   board before SMT or use x-y application??
3) What issues are there generally (boards are designed for
   this process);

Generally any comments are welcome.

Thanks for your inputs,

Douglas I McCall,



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