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March 2003

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Subject:
From:
Daan Terstegge <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 31 Mar 2003 21:45:59 +0200
Content-Type:
text/plain
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text/plain (138 lines)
Hi John,

Normally you don't need any glue at all. The total surface area of the
solder joints is very large compared to the weight of the part, therefore a
BGA will not fall off during inverted reflow. Just be carefull with
heatsinked parts, as they can be quite heavy.

Daan Terstegge
http://www.smtinfo.net


----- Original Message -----
From: "John Belcher" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, March 31, 2003 9:28 PM
Subject: Re: [TN] BGA's on both sides of an assembly


> Thanks Ramon. That's exactly what I needed.
> John Belcher
> ----- Original Message -----
> From: "Dehoyos, Ramon" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Monday, March 31, 2003 11:12 AM
> Subject: Re: [TN] BGA's on both sides of an assembly
>
>
>         John:
>         After reflowing one side, glue the BGAs with water soluble glue,
> then do the other side. After the wash, the glue will be gone. The four
> corners are the better areas for placing glue. Make sure that glue does
not
> come in contact with solder joints to avoid glue solder combination.
>         Regards,
>         Ramon
>
>
>
> > -----Original Message-----
> > From: john Belcher [mailto:[log in to unmask]]
> > Sent: Montag, 31. März 2003 17:57
> > To: [log in to unmask]
> > Subject: [TN] BGA's on both sides of an assembly
> >
> >
> > Any secrets to mounting BGA's on both sides of an assembly?
> >
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