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March 2003

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Subject:
From:
DUTTON Phil <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 27 Mar 2003 10:12:30 +1100
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Hello Bill,

Can't point you to any specs, but I'm personally of the opinion that removing non functional pads from internal layers will create a resin rich zone around the holes. This is something that you don't really want during reflow temperatures - more pressure on the plating barrel.

regards,

Phil.



-----Original Message-----
From: Bill Decray [mailto:[log in to unmask]]
Sent: Thursday, 27 March 2003 7:04 AM
To: [log in to unmask]
Subject: [TN] non functional pad removal


Hello fellow TechNet Guru
Does anyone have or know off any specifications that talk about removal of
non functional pads and what effects it has on a finished circuit boards if
any



Highest Regards,

William W. DeCray III
Waytec Electronics Corp
Engineering Services Manager
PHONE:(434) 237-6391 ext 115
CELL:   (434) 851-6115
FAX:    (434) 237-1324
E-mail:<[log in to unmask]>
Web http://www.waytec.com
FTP  ftp://ftp.waytec.com

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