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March 2003

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Subject:
From:
Debbie Goodwin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 26 Mar 2003 07:42:30 -0800
Content-Type:
text/plain
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text/plain (209 lines)
Hi George,

We are not getting boards assembled.
We provide "dummy" packages to the industry, so we interact a lot with the
component manufacturers.

Most of the Pb-free components that we supply these days are to companies
who are qualifying their processes for Pb-free.

Sincerely,

Debbie Goodwin
Account Representative
10867 Portal Dr
Los Alamitos, CA 90720
Phone = (714) 252-0010
Fax = (714) 252-0026
[log in to unmask]

PLEASE NOTE  - Over 90% of all SMT packages are now available Lead-Free!!!
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-----Original Message-----
From: Wenger, George M. [mailto:[log in to unmask]]
Sent: Tuesday, March 25, 2003 4:32 PM
To: [log in to unmask]
Subject: Re: [TN] component lead plating/tinning


Debbie,
Are the Pb-free SMT packages you are getting assembled on boards using
Pb-free solder paste or are they assembled using SnPb solder paste?
Several years ago the previous company I worked for began using chip
capacitors that had 100% Sn terminations because they found that there
was enough diffusion of Pb from the SnPb surface mount solder paste to
"poison" (i.e., prevent tin whiskers) the 100% tin on the component
termination thus meeting the Telcordia requirement.

Regards,
George
George M. Wenger Andrew Corporation
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [log in to unmask]


-----Original Message-----
From: Debbie Goodwin [mailto:[log in to unmask]]
Sent: Tuesday, March 25, 2003 6:35 PM
To: [log in to unmask]
Subject: Re: [TN] component lead plating/tinning

Hi Joe,

I cannot address tin whiskers, but I can tell you that we are getting
many
lead-free SMT packages these days.

Chip resistors, Chip capacitors, SOICs, SOTs, and PLCCs are all coming
with
100% tin as the qualified lead-free formulation from the factories we
deal
with.

QFP packages have been available in several finishes as the factories
try to
decide which finishes they want to offer.
100% tin is one of the finishes I have seen on QFPs, though Sn/Cu is
more
common so far.

I hope that this information is of some value.

Sincerely,

Debbie Goodwin
Account Representative
10867 Portal Dr
Los Alamitos, CA 90720
Phone = (714) 252-0010
Fax = (714) 252-0026
[log in to unmask]

PLEASE NOTE  - Over 90% of all SMT packages are now available
Lead-Free!!!
__________________________________________________
This message is intended for the use of the individual entity to which
it is
addressed and may contain information that is privileged, confidential
and
exempt from disclosure under applicable law.  If the reader of this
message
is not the intended recipient, or the employee or agent responsible for
delivering the message to the intended recipient, you are hereby
notified
that any dissemination, distribution or copying of this communication is
strictly prohibited.  If you have received this communication in error,
please notify us immediately by calling
714.252.0010 or returning the original message to us.  Thank You.



-----Original Message-----
From: Macko, Joe @ IEC [mailto:[log in to unmask]]
Sent: Tuesday, March 25, 2003 2:49 PM
To: [log in to unmask]
Subject: [TN] component lead plating/tinning


Fellow Technets,

As the industry moves towards lead-free solder, I am getting a lot of
internal questions regarding the phenomena of tin whiskers and the types
of
plating/tinning used on component leads.  There is a general concern
that
100% tin plated leads may lead to the formation of tin whiskers after
board
assembly.   I am not that familiar with the phenomena of whisker
formation
or the industry standard(s) for plating of component leads but have read
articles that imply that industry is moving towards 100% tin plating on
component leads so they are compatible with leaded and non-leaded
solders.
Who can enlighten me on this as well as the formation of tin whiskers?
many
thanks in advance.

joe

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