Hi Joe! Answering your question is as simple as "boiling the ocean"! The
subject of tin whiskers is a huge topic of focus for a number of industry
groups. One good place to start is: http://nepp.nasa.gov/whisker/index.html
.   The NASA folks (Jay Brusse specifically) have been a great industry
resource for tin whisker information. Tin whiskers has also been a frequent
topic in the IPC technical conferences too. Good Luck

Dave Hillman
Rockwell Collins
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                      "Macko, Joe @
                      IEC" <joe.macko          To:       [log in to unmask]
                      Sent by: TechNet         cc:
                      <[log in to unmask]>        Subject:  [TN] component lead plating/tinning


                      03/25/2003 04:49
                      PM
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please
                      respond to
                      "Macko, Joe @
                      IEC"






Fellow Technets,

As the industry moves towards lead-free solder, I am getting a lot of
internal questions regarding the phenomena of tin whiskers and the types of
plating/tinning used on component leads.  There is a general concern that
100% tin plated leads may lead to the formation of tin whiskers after board
assembly.   I am not that familiar with the phenomena of whisker formation
or the industry standard(s) for plating of component leads but have read
articles that imply that industry is moving towards 100% tin plating on
component leads so they are compatible with leaded and non-leaded solders.
Who can enlighten me on this as well as the formation of tin whiskers?
many
thanks in advance.

joe

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