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March 2003

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Subject:
From:
Debbie Goodwin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 25 Mar 2003 15:35:25 -0800
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Hi Joe,

I cannot address tin whiskers, but I can tell you that we are getting many
lead-free SMT packages these days.

Chip resistors, Chip capacitors, SOICs, SOTs, and PLCCs are all coming with
100% tin as the qualified lead-free formulation from the factories we deal
with.

QFP packages have been available in several finishes as the factories try to
decide which finishes they want to offer.
100% tin is one of the finishes I have seen on QFPs, though Sn/Cu is more
common so far.

I hope that this information is of some value.

Sincerely,

Debbie Goodwin
Account Representative
10867 Portal Dr
Los Alamitos, CA 90720
Phone = (714) 252-0010
Fax = (714) 252-0026
[log in to unmask]

PLEASE NOTE  - Over 90% of all SMT packages are now available Lead-Free!!!
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-----Original Message-----
From: Macko, Joe @ IEC [mailto:[log in to unmask]]
Sent: Tuesday, March 25, 2003 2:49 PM
To: [log in to unmask]
Subject: [TN] component lead plating/tinning


Fellow Technets,

As the industry moves towards lead-free solder, I am getting a lot of
internal questions regarding the phenomena of tin whiskers and the types of
plating/tinning used on component leads.  There is a general concern that
100% tin plated leads may lead to the formation of tin whiskers after board
assembly.   I am not that familiar with the phenomena of whisker formation
or the industry standard(s) for plating of component leads but have read
articles that imply that industry is moving towards 100% tin plating on
component leads so they are compatible with leaded and non-leaded solders.
Who can enlighten me on this as well as the formation of tin whiskers?  many
thanks in advance.

joe

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