Fellow Technets,

As the industry moves towards lead-free solder, I am getting a lot of
internal questions regarding the phenomena of tin whiskers and the types of
plating/tinning used on component leads.  There is a general concern that
100% tin plated leads may lead to the formation of tin whiskers after board
assembly.   I am not that familiar with the phenomena of whisker formation
or the industry standard(s) for plating of component leads but have read
articles that imply that industry is moving towards 100% tin plating on
component leads so they are compatible with leaded and non-leaded solders.
Who can enlighten me on this as well as the formation of tin whiskers?  many
thanks in advance.

joe

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