Steve,

Have you tried Senform? Look in the old PCFabs/Circuitries and
they advertise there.  They sell a complete system for daming the
adhesive ooze. If you can't find them email me and I'll look around
for a phone number.

pete


On 10 Mar 03, at 16:35, Steve kelly wrote:

> My customer has asked if it is possible to control the glue squeeze on
> covercoat openings 100% of the time to .0025 or less. The covercoat is
> an LFO-0110 from DuPont. The parts have approx. 250 SMT openings on the
> top and 300 on the bottom. Openings are normally .026 x .026 or .030 x
> .036. We are not allowed to laser. This is a volume part so whatever is
> suggested must be cost effective. We have tried various combinations of
> press pad make-ups and pre-baking of the covercoats. We hold about 95%
> of the pads to .0025-.003 but have not been able to guarantee 100%.
>
> Thanks for your time.
>
>
>
> Regards Steve Kelly
>
>
>
> PFC Flexible Circuits Limited
>
>
>
>
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Peter Menuez
QA Manager
Proto Circuit, Inc.
330-572-3400
[log in to unmask]

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