Thanks, Guy, BUT this has to do with cleaning rather than mechanical reliability. 
Bev
--------------------------
Sent from my BlackBerry Wireless Handheld (www.BlackBerry.net)


-----Original Message-----
From: Guy Ramsey <[log in to unmask]>
To: 'TechNet E-Mail Forum.' <[log in to unmask]>; Bev Christian <[log in to unmask]>
Sent: Thu Mar 20 13:17:55 2003
Subject: RE: [TN] SMT Component Standoffs

 
There is help in IPC-SM-782A section 3.6.1.7 Component Stand Off Height
for Cleaning and the associated table 3-7. The stand off recommendation
varies with the component size. For example small component < 3mm x 3mm
stand off > 0.05 mm.
A large component 50mm x 50 mm stand off > 0.5 mm. 

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
> Sent: Thursday, March 20, 2003 12:56 PM
> To: [log in to unmask]
> Subject: [TN] SMT Component Standoffs
> 
> 
> TechNetters,
> When I was at a former employer there was a minimum stand off 
> in the company specs.  I have forgotten what that was.  Now I 
> know that it can/should be different based on the solder, use 
> environment, pad sizes and lead/termination materials, but I 
> was wondering if anyone would be willing to share what they 
> have on the subject. I am particularly interested in land 
> grid array devices, if I may be so bold as to be picky.  :)   
> Thanks in advance.
> Bev Christian
> Research in Motion
> 
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