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March 2003

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Thu, 20 Mar 2003 12:31:56 -0500
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How about "Harzardous Material Safety"

Good Luck!




                                                                                                                                       
                      "Crepeau, Phil"                                                                                                  
                      <Phil.Crepeau@TRW        To:       [log in to unmask]                                                               
                      .COM>                    cc:                                                                                     
                      Sent by: TechNet         Subject:  Re: [TN] Via Fill and Soldermask                                              
                      <[log in to unmask]>                                                                                                
                                                                                                                                       
                                                                                                                                       
                      03/20/2003 10:07                                                                                                 
                      AM                                                                                                               
                      Please respond to                                                                                                
                      "TechNet E-Mail                                                                                                  
                      Forum."; Please                                                                                                  
                      respond to                                                                                                       
                      "Crepeau, Phil"                                                                                                  
                                                                                                                                       
                                                                                                                                       





hughes  material specification.
-----Original Message-----
From: Hendy, LeRoy  [mailto:[log in to unmask]]
Sent: Wednesday, March 19, 2003  5:28 PM
To: [log in to unmask]
Subject: [TN] Via Fill and  Soldermask


Hello  All,

I have a customer  whose print notes call for vias to be filled with Hysol
1C per HMS 20-2092 and  to soldermask per IPC-SM-840 class "H" using HMS
2389 type II. Does  anybody know what  "HMS" stands for? I cant seem to
find any  reference on the web other than Navy ships.

LeRoy Hendy
DFM  Center
Sanmina-SCI
(408) 557-7877

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