Of course - you can use either double treat copper foil or drum side treated
copper foil, and just use an alkali cleaner and good rinse and thorough dry
before bond (do not use a microetch process as it destroys the surface
topography that will give the good bond) OR use standard profile copper and
microetch the surface to give the topography required (numerous proprietary
systems now in existence).
Dougal Stewart
email: [log in to unmask]
phone: +44 1896 822204
mob: +44 7984 629667
www.pwbsolutions.co.uk
----- Original Message -----
From: "Mike Wolf" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, March 20, 2003 12:53 PM
Subject: [TN] Adhesion without oxide?
Is it possible to get good adhesion on inner layers without an oxide
treatment?
Michael Wolf
EH&S Manager
EVI Technology LLC
7138 Columbia Gateway Drive
Columbia MD 21046
Phone # 443-542-0127
Fax # 410-290-1925
[log in to unmask]
www.evitechnology.com
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