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March 2003

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Subject:
From:
Steve MacDonald <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 19 Mar 2003 11:56:07 -0500
Content-Type:
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Greetings

Sounds grounded in reality Hans.  Design limitations and cost effectiveness
of templates for every potentially "profitable" board layout on every panel
size you run can have a sobering affect on the desire for coupons that tell
you about your board fab.  It's a real challange.  It comes down to time and
money every time, and the coupon gets stuck beyond the theiving where no
board would ever be built.  You have to be convincing when you try to get
that coupon placed in the panel. (Good boards are good money)

Raghavendra-

While the coupon design can satisfy the requirements (Brian says IPC 2141 is
the place to look) you need to get that coupon in between the boards on the
panel, particularly on an impedence bd.  (Any board really) And Fab needs to
be doing dimensional measurments at every opportinity on every critical
layer and circuit path anyway, IMHO. Get it into the process notes if you
can.

Good Luck.

Steve.

----- Original Message -----
From: "Hinners Hans M Civ WRALC/LUGE" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, March 19, 2003 09:45
Subject: Re: [TN] Test coupon for Impedance Control Board.


> Hi Raghavendra or should I call you Rao,
>
> A plea from a former lamination guy.
>
> Please keep the realities of the manufacturing process in mind.  The
> impedance coupons I remember didn't have alot of copper - hence an area of
> reduced pressure. To make matters worse the artwork department would place
> the coupon in the panel border area.  This are might not be representative
> of the board area.  The result, a coupon that might pass impedance testing
> when the boards wouldn't or a coupon that would fail when the boards were
> fine.  If the lamination cycle was borderline for the design we'd get
resin
> voids in the coupons.
>
> It's been a while since I got my hands dirty (in pcb fab at least) so if
> I've got something wrong speak up.
>
> Hans
>
> ~~~~~~~~~~~~~~~~~~~~~~~~~~~
> Hans M. Hinners
> AC-130 Systems Engineer (Hardware)
> Warner Robins Air Logistics Center (WR-ALC)
> 226 Cochran Street
> Robins AFB, GA 31098-1622
> Tele: (478) 926 - 5847 [DSN Prefix: 468]
> Fax: (478) 926 - 4911
> mailto:[log in to unmask]
>
>
> -----Original Message-----
> From: Brian Butler [mailto:[log in to unmask]]
> Sent: Tuesday, March 18, 2003 9:40 PM
> To: [log in to unmask]
> Subject: Re: [TN] Test coupon for Impedance Control Board.
>
>
> Raghavendra,
>
> The IPC publishes a standard IPC 2141 document which discusses HIgh
> Frequency design issues including controlled impedance coupon design. The
> document is available from IPC at www.ipc.org. (This document is currently
> under revision).
>
> Sincerely,
> Brian Butler
> Introbotics Corporation
>
>
> At 05:43 PM 3/18/03 +0530, you wrote:
> >Hello everybody,
> >
> >I am in the process of design of Test Coupon for the fabrication of
> >Impedance Control Board.  Kindly help me by sending inputs regarding the
> >points to be considered for design of test coupon for Impedance Control
> >Board.
> >
> >Is any one is having detailed drawing or Gerber of test coupon?
> >
> >Raghavendra Rao
> >[log in to unmask]
> >
> >
> >
> >
> >
> >
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