OK, here it is a year later and I have a follow one question related to
this subject:
Has anyone found a supplier of preforms similar to the Solderquik one made
by Winslow Automation for devices with pitches of 0.5mm or less?
Does anyone have a reliability tested method which works with high yields
for reballing such devices?
What do you do if you do not have such a method (scrap them or what)?
I realize that such components can be reworked using only solderbumps, but
we need the solderball height in our application to make up for the
differences in coplanarity that the connection has to deal with.
Thanks in advance.
At 08:49 AM 3/22/2002 -0500, Francois Monette wrote:
>Justin,
>
>As far as I know, the number 3 that came up in other replies is based on the
>fact that all moisture sensitive components, including PBGAs, are
>pre-conditioned with 3 reflow cycles prior to package qualification (ref.
>J-STD-020 and J-STD-033). This is done right after soaking the parts to
>their specified moisture content. This means that you can rely on the fact
>that the parts will survive at least 3 reflow cycles at their maximum floor
>life which is defined by their MS level. Beyond that, there is no data to
>guarantee the reliability of the component. Of course if you bake the parts
>prior to reflow you will reduce the concern relative to moisture/reflow
>damage. On the other hand, there is also a limit specified for the maximum
>number of bake cycles at 125C (currently only one bake cycle allowed),
>because of solderability issues.
>
>As someone already pointed out, boards with BGAs on both sides imply at
>least two reflow cycles to begin with. Removal, re-attachment and reballing
>should also be considered if the package body exceeds 200C. This is the
>critical limit set by the IPC/JEDEC standard to define a reflow cycle which
>can cause potential internal damage to the parts.
>
>I hope this is helpful.
>
>Francois Monette
>Cogiscan Inc.
>Tel : 450-534-2644
>Fax : 450-534-0092
>E-mail : [log in to unmask]
>www.cogiscan.com
>
>
>
>Date: Thu, 21 Mar 2002 14:27:48 -0000
>From: "Braime, Justin" <[log in to unmask]>
>Subject: BGA reballing
>
>Hi guys,
>I am looking at using the SolderQuik preforms for reballing some BGAs, but I
>am concerned about the reliability of this process in terms of the number of
>thermal cycles being sustained by the BGA component. Does anybody know of
>any studies done on this?
>
>Thanks
>
>Justin Braime
>Senior Production Engineer
>
>Racal Instruments Ltd
>480 Bath Rd, Slough
>Berkshire, SL1 6BE
>England
>
>Tel: +44 (0)1628 604455
>Fax: +44 (0)1628 662017
>E-mail: [log in to unmask]
>
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