Ramon,

Although I am not familiar with the spacers which you mention, it does sound
like a 'good' way to get cracks in the glass to metal seals - leading to who
knows what later on.

Moving the bend radius out from the glass to metal seal IS what you want (at
least for a high rel type of part).

To me, farther = better.

Steve Creswick - Gentex Corp

-----Original Message-----
From: Dehoyos, Ramon [mailto:[log in to unmask]]
Sent: Monday, March 03, 2003 9:33 AM
To: [log in to unmask]
Subject: [TN] Can ICs


                Does anybody have experience with spacers made by Robison
Electronics, Inc. for 8 and 10 leaded round pattern 0.220 in. to 0.400 in.
metal can ICs ? This spacers not only keep the Can ICs off the board but
form the leads from a round pattern of 0.220 to 0.400 in.  The reason I have
a question is that at close observation the leads bend outwards from the
base slightly when the leads are inserted through the spacer.  In the ANSI J
standard, it states that when forming a lead the bend should start at a
minimum of one lead thickness.
        Thanks in advance for your inputs.
                Regards,
                Ramon

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