If this is a possibility, I too would
like to see a copy of the draft
Barry.
-----Original Message-----
From: Hernandez, Victor G [mailto:[log in to unmask]]
Sent: Thursday, March 13, 2003 7:58 AM
To: [log in to unmask]
Subject: Re: [TN] Mixing fluxes - documentation vacuum
Phil,
I have been following the string of mail on this topic. I too have had
questions regarding compatability. Could I have a copy of the draft.
Victor,
-----Original Message-----
From: Phil Kinner [mailto:[log in to unmask]]
Sent: Thursday, March 13, 2003 7:59 AM
To: [log in to unmask]
Subject: Re: [TN] Mixing fluxes - documentation vacuum
Bev,
IEC 61189-5 is a draft spec, currently at an advanced stage (final draft I
believe) which deals with process characterization using SIR, to ensure that
all the chemistries used in the assembly of a PCA are compatible and that
the assembly process is good from an SIR point of view.
If you'd like a copy, I'm sure I could sort you out with something.
Best Regards,
Phil Kinner
Concoat Ltd
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: 13 March 2003 13:26
To: [log in to unmask]
Subject: Re: [TN] Mixing fluxes - documentation vacuum
If the fluxing materials come from different suppliers you will never get
them to officially put in print that they are compatible with each other. I
know if I were them, I never would. Think of all the combinations they
would have to test!
Now if you are lucky, on a good day you might get some of the bigger
companies to say their own wave flux and own solder paste are compatible.
I know for a fact that some fluxes/solder pastes produced five years ago
were not compatible with certain solder masks. But things have got better
in terms of both the flux and solder mask chemistries, so this is much more
rare.
Some companies also have internal tests where they mix their wave solder
flux, paste flux, cored wire flux and chip adhesive and test that dog's
breakfast using SIR and electromigration. Again they are obviously only
testing the most likely combinations, not every combination possible from
their AVL (approved vendor list).
But I know of no standard that specifically deals with this issue.
regards,
Bev Christian
Research in Motion
-----Original Message-----
From: Cagle, James [mailto:[log in to unmask]]
Sent: March 12, 2003 1:52 PM
To: [log in to unmask]
Subject: Re: [TN] Mixing fluxes - documentation vacuum
In J-STD-001,it says the fluxes must be compatible. Have your CM show you
data from both Paste/Flux manufacture that their products are OK to be used
with each other. >
> James Cagle
> Tyco Printed Circuit Group-Hayward Division
>
> email: [log in to unmask]
>
-----Original Message-----
From: Dave Hillman [mailto:[log in to unmask]]
Sent: Tuesday, March 11, 2003 7:45 AM
To: [log in to unmask]
Subject: Re: [TN] Mixing fluxes - documentation vacuum
Hi John! Take a look in the IPC-HDBK-001, section 7.2.1 flux application,
last paragraph. There is a cautionary statement (similar to the JSTD-001
statement Guy referenced) about the mixing of fluxes and the potential
hazard of added liquid flux as a soldering aid.
Dave Hillman
Rockwell Collins
[log in to unmask]
"Vivari, John"
<[log in to unmask] To: [log in to unmask]
COM> cc:
Sent by: TechNet Subject: [TN] Mixing fluxes
- documentation vacuum
<[log in to unmask]>
03/11/2003 08:10
AM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to
"Vivari, John"
Dear TechNetters,
A customer of ours came to us with a request for a reference to an IPC
document or other industry standard that explicitly states the hazards of
mixing flux types on an assembly. He asked for this because his contract
manufacturer built a set of boards using a No-clean solder paste and
reworked some BGAs with a water soluble solder paste. The contract
manufacture states that he cannot find a standard "anywhere" that says the
flux types should not be mixed or that there will be any long term
reliability issues. I know this seems naive but that is their position.
We have searched our library of specifications, books, and industry
periodicals and have come up empty except for vague statements about having
to clean between soldering operations for certain classes of product without
explaining why and a reference in Ning-Cheng Lee's new book cautioning
against combining incompatible fluxes between reflow and wave soldering. We
are well versed in the hazards of mixing our own fluxes (never mind others)
but have never been asked to provide "industry standard documentation"
before (as opposed to a letter of explanation).
Can anyone point to a reference that we have missed?
Hopefully yours,
John Vivari
Technical Service Engineer
EFD Inc.
[log in to unmask]
www.efdsolder.com
Ph: 401-333-3800
Fx: 401-333-4954
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