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March 2003

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 13 Mar 2003 16:29:18 +0200
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Phil

SIR is most certainly not the be all and end all of flux compatibility.
Whereas SIR may be used as a negative test (poor SIR = poor
compatibility, good SIR does NOT necessarily mean good compatibility),
other tests are also necessary.

Brian

Phil Kinner wrote:
> Bev,
>
> IEC 61189-5 is a draft spec, currently at an advanced stage (final draft I
> believe) which deals with process characterization using SIR, to ensure that
> all the chemistries used in the assembly of a PCA are compatible and that
> the assembly process is good from an SIR point of view.
>
> If you'd like a copy, I'm sure I could sort you out with something.
>
> Best Regards,
>
> Phil Kinner
> Concoat Ltd
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
> Sent: 13 March 2003 13:26
> To: [log in to unmask]
> Subject: Re: [TN] Mixing fluxes - documentation vacuum
>
> If the fluxing materials come from different suppliers you will never get
> them to officially put in print that they are compatible with each other. I
> know if I were them, I never would.  Think of all the combinations they
> would have to test!
>
> Now if you are lucky, on a good day you might get some of the bigger
> companies to say their own wave flux and own solder paste are compatible.
>
> I know for a fact that some fluxes/solder pastes produced five years ago
> were not compatible with certain solder masks.  But things have got better
> in terms of both the flux and solder mask chemistries, so this is much more
> rare.
>
> Some companies also have internal tests where they mix their wave solder
> flux, paste flux, cored wire flux and chip adhesive and test that dog's
> breakfast using SIR and electromigration.  Again they are obviously only
> testing the most likely combinations, not every combination possible from
> their AVL (approved vendor list).
>
> But I know of no standard that specifically deals with this issue.
>
> regards,
> Bev Christian
> Research in Motion
>
> -----Original Message-----
> From: Cagle, James [mailto:[log in to unmask]]
> Sent: March 12, 2003 1:52 PM
> To: [log in to unmask]
> Subject: Re: [TN] Mixing fluxes - documentation vacuum
>
>
> In J-STD-001,it says the fluxes must be compatible. Have your CM show you
> data from both Paste/Flux manufacture that their products are OK to be used
> with each other. >
>
>>                                 James Cagle
>>Tyco Printed Circuit Group-Hayward Division
>>
>>              email: [log in to unmask]
>>
>
>
>
> -----Original Message-----
> From: Dave Hillman [mailto:[log in to unmask]]
> Sent: Tuesday, March 11, 2003 7:45 AM
> To: [log in to unmask]
> Subject: Re: [TN] Mixing fluxes - documentation vacuum
>
>
> Hi John! Take a look in the IPC-HDBK-001, section 7.2.1 flux application,
> last paragraph. There is a cautionary statement (similar to the JSTD-001
> statement Guy referenced) about the mixing of fluxes and the potential
> hazard of added liquid flux as a soldering aid.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
>                       "Vivari, John"
>                       <[log in to unmask]        To:       [log in to unmask]
>                       COM>                     cc:
>                       Sent by: TechNet         Subject:  [TN] Mixing fluxes
> - documentation vacuum
>                       <[log in to unmask]>
>
>
>                       03/11/2003 08:10
>                       AM
>                       Please respond to
>                       "TechNet E-Mail
>                       Forum."; Please
>                       respond to
>                       "Vivari, John"
>
>
>
>
>
>
> Dear TechNetters,
>
> A customer of ours came to us with a request for a reference to an IPC
> document or other industry standard that explicitly states the hazards of
> mixing flux types on an assembly.  He asked for this because his contract
> manufacturer built a set of boards using a No-clean solder paste and
> reworked some BGAs with a water soluble solder paste.  The contract
> manufacture states that he cannot find a standard "anywhere" that says the
> flux types should not be mixed or that there will be any long term
> reliability issues.  I know this seems naive but that is their position.
>
> We have searched our library of specifications, books, and industry
> periodicals and have come up empty except for vague statements about having
> to clean between soldering operations for certain classes of product
> without
> explaining why and a reference in Ning-Cheng Lee's new book cautioning
> against combining incompatible fluxes between reflow and wave soldering.
> We
> are well versed in the hazards of mixing our own fluxes (never mind others)
> but have never been asked to provide "industry standard documentation"
> before (as opposed to a letter of explanation).
>
> Can anyone point to a reference that we have missed?
>
> Hopefully yours,
>
> John Vivari
> Technical Service Engineer
> EFD Inc.
> [log in to unmask]
> www.efdsolder.com
> Ph: 401-333-3800
> Fx: 401-333-4954
>
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>
>
>

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