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March 2003

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Subject:
From:
Dave Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 12 Mar 2003 17:13:01 -0600
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Hi Randy! Any component that has been adequately/correctly tinned should be
able to meet the solderability requirements of JSTD-002B. I recommend you
take a sample of the "dip-n-spin" components and conduct a solderability
test per the 002B specification. If the "dip-n-spin" process is resulting
in too thin of solder coverage I would imagine that the steam conditioning
step of the 002B solderability test will cause enough oxidation that the
components will fail the test requirements. Having too thin of a solderable
coating which in turn allows for oxidation of a component's lead base metal
is a classic cause of solderability problems. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]



                                                                                                                                       
                      "Mummert, Randy"                                                                                                 
                      <randy.mummert@BO        To:       [log in to unmask]                                                               
                      EING.COM>                cc:                                                                                     
                      Sent by: TechNet         Subject:  [TN] Tinning requirements                                                     
                      <[log in to unmask]>                                                                                                
                                                                                                                                       
                                                                                                                                       
                      03/12/2003 04:22                                                                                                 
                      PM                                                                                                               
                      Please respond to                                                                                                
                      "TechNet E-Mail                                                                                                  
                      Forum."; Please                                                                                                  
                      respond to                                                                                                       
                      "Mummert, Randy"                                                                                                 
                                                                                                                                       
                                                                                                                                       





Hello  all,
I need to find  requirements which specify lead tinning requirements.
We have a supplier  which is performing a lead tinning process called
"DIP-N-SPIN". Is anyone using  this process? The device is dipped and then
spun at 2000RPM. This process leaves a  very thin layer of tin/lead on the
leads. Measured data shows  20micro-inches, this is over Kovar leads. Seems
I remember 300 micro-inches from  some document. We're having problems with
solderability and fractured  solder joints. IPC or MIL standards would be
great.
Thanks in  advance,
Randy



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