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March 2003

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Subject:
From:
"Cagle, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 12 Mar 2003 13:52:11 -0500
Content-Type:
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text/plain (123 lines)
In J-STD-001,it says the fluxes must be compatible. Have your CM show you
data from both Paste/Flux manufacture that their products are OK to be used
with each other. >
>                                  James Cagle
> Tyco Printed Circuit Group-Hayward Division
>
>               email: [log in to unmask]
>


-----Original Message-----
From: Dave Hillman [mailto:[log in to unmask]]
Sent: Tuesday, March 11, 2003 7:45 AM
To: [log in to unmask]
Subject: Re: [TN] Mixing fluxes - documentation vacuum


Hi John! Take a look in the IPC-HDBK-001, section 7.2.1 flux application,
last paragraph. There is a cautionary statement (similar to the JSTD-001
statement Guy referenced) about the mixing of fluxes and the potential
hazard of added liquid flux as a soldering aid.

Dave Hillman
Rockwell Collins
[log in to unmask]




                      "Vivari, John"
                      <[log in to unmask]        To:       [log in to unmask]
                      COM>                     cc:
                      Sent by: TechNet         Subject:  [TN] Mixing fluxes
- documentation vacuum
                      <[log in to unmask]>


                      03/11/2003 08:10
                      AM
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please
                      respond to
                      "Vivari, John"






Dear TechNetters,

A customer of ours came to us with a request for a reference to an IPC
document or other industry standard that explicitly states the hazards of
mixing flux types on an assembly.  He asked for this because his contract
manufacturer built a set of boards using a No-clean solder paste and
reworked some BGAs with a water soluble solder paste.  The contract
manufacture states that he cannot find a standard "anywhere" that says the
flux types should not be mixed or that there will be any long term
reliability issues.  I know this seems naive but that is their position.

We have searched our library of specifications, books, and industry
periodicals and have come up empty except for vague statements about having
to clean between soldering operations for certain classes of product
without
explaining why and a reference in Ning-Cheng Lee's new book cautioning
against combining incompatible fluxes between reflow and wave soldering.
We
are well versed in the hazards of mixing our own fluxes (never mind others)
but have never been asked to provide "industry standard documentation"
before (as opposed to a letter of explanation).

Can anyone point to a reference that we have missed?

Hopefully yours,

John Vivari
Technical Service Engineer
EFD Inc.
[log in to unmask]
www.efdsolder.com
Ph: 401-333-3800
Fx: 401-333-4954

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