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March 2003

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Subject:
From:
Scott Westheimer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 3 Mar 2003 11:26:07 -0500
Content-Type:
text/plain
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text/plain (140 lines)
I have not come across any IPC or other standard that addresses finished
board thickness and where that measurement is to be taken. There is
specifications for raw laminate but not finished boards.
Scott B. Westheimer
General Manager,
Gultech North Carolina
5800 McHines Place
Raleigh, North Carolina 27616
Phone: (919)872-0100
Fax: (919)713-4849
Cell: (919)649-1510
Toll Free: 1-866-gultech
[log in to unmask]
Web Page: www.gultechna.com
----- Original Message -----
From: "Franklin D Asbell" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, March 03, 2003 10:31 AM
Subject: Re: [TN] PC Board thickness measurement


> Yes, that is the opinion I share...is that written somewhere though...
>
> When it is not specified...what criteria is followed???
>
> Franklin
>
>
> ----- Original Message -----
> From: "Scott Westheimer" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Monday, March 03, 2003 8:52 AM
> Subject: Re: [TN] PC Board thickness measurement
>
>
> > Franklin,
> >
> > Thickness is usually defined by customer as well as where the
measurements
> > are to be taken. It may state glass to glass, metal to metal or mask to
> > mask.
> >
> > Scott B. Westheimer
> > General Manager,
> > Gultech North Carolina
> > 5800 McHines Place
> > Raleigh, North Carolina 27616
> > Phone: (919)872-0100
> > Fax: (919)713-4849
> > Cell: (919)649-1510
> > Toll Free: 1-866-gultech
> > [log in to unmask]
> > Web Page: www.gultechna.com
> > ----- Original Message -----
> > From: "Franklin D Asbell" <[log in to unmask]>
> > To: <[log in to unmask]>
> > Sent: Monday, March 03, 2003 9:49 AM
> > Subject: [TN] PC Board thickness measurement
> >
> >
> > > In what IPC specification is board thickness measurement (location)
> > > referenced?
> > >
> > > I'm looking for where overall thickness is mentioned. I'm receiving
> > > conflicting information on whether the required board thickness is to
be
> > > measured over foil copper (multilayer, after layup), over
> > soldermask/glass,
> > > or over final finish.
> > >
> > > And is there information differentiating between OSP or flat coatings
> and
> > > HASL or reflow if final thickness is measured over...final finish...
> > >
> > > Thanks.
> > >
> > > Franklin
> > >
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>
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