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March 2003

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Subject:
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 3 Mar 2003 09:31:59 -0600
Content-Type:
text/plain
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text/plain (98 lines)
Yes, that is the opinion I share...is that written somewhere though...

When it is not specified...what criteria is followed???

Franklin


----- Original Message -----
From: "Scott Westheimer" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, March 03, 2003 8:52 AM
Subject: Re: [TN] PC Board thickness measurement


> Franklin,
>
> Thickness is usually defined by customer as well as where the measurements
> are to be taken. It may state glass to glass, metal to metal or mask to
> mask.
>
> Scott B. Westheimer
> General Manager,
> Gultech North Carolina
> 5800 McHines Place
> Raleigh, North Carolina 27616
> Phone: (919)872-0100
> Fax: (919)713-4849
> Cell: (919)649-1510
> Toll Free: 1-866-gultech
> [log in to unmask]
> Web Page: www.gultechna.com
> ----- Original Message -----
> From: "Franklin D Asbell" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Monday, March 03, 2003 9:49 AM
> Subject: [TN] PC Board thickness measurement
>
>
> > In what IPC specification is board thickness measurement (location)
> > referenced?
> >
> > I'm looking for where overall thickness is mentioned. I'm receiving
> > conflicting information on whether the required board thickness is to be
> > measured over foil copper (multilayer, after layup), over
> soldermask/glass,
> > or over final finish.
> >
> > And is there information differentiating between OSP or flat coatings
and
> > HASL or reflow if final thickness is measured over...final finish...
> >
> > Thanks.
> >
> > Franklin
> >
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