It was not possible for me to go to the International Conference on
Lead-Free Electronic Components and Assemblies in Taiwan, December 2002.
I have been trying to get the proceedings of this conference but up to now
it has been impossible. Does anybody tell me where can I get them?
Best regards
E. González
-----Mensaje original-----
De: Jack Crawford [mailto:[log in to unmask]]
Enviado el: viernes, 25 de octubre de 2002 22:24
Para: [log in to unmask]
Asunto: [LF] IPC/JEDEC announce Taipei Conf on LF Comp & Assy
IPC-Association Connecting Electronics Industries and JEDEC-the Solid State
Technology Association are sponsoring an International Conference on
Lead-Free Electronic Components and Assemblies from December 9-12 2002 at
the Grand Hyatt Taipei, Taipei Taiwan, No. 2 Sung Shou Road, Taipei, Taiwan.
Martin Freedman, Molex, and David Bergman, IPC, are the Conference Chairs.
CLICK HERE TO DOWNLOAD THE BROCHURE AND REGISTRATION FORM:
http://www.ipc.org/LF/LeadFreeConference.htm
The European Union marches closer to establishing a firm date for lead
elimination in most electronics. Public and political pressure against lead
continues to grow, especially outside the US. Japan, Denmark and the
European Union (EU) are all proposing bans on lead and products containing
lead. International OEMs are becoming more sensitive to the issue and
continue to press their suppliers to develop plans.
A ban in Europe will have an effect in the global marketplace, which will
force many manufacturers to eliminate lead as effectively as a their own
country ban. Data is now coming in from individual companies' and consortia
efforts.
Many challenges still exist and the path forward to success is not one of
consensus. Companies need to stay aware of the hot issues remaining in order
to focus efforts that will allow success to be achieved by 2006-2007.
Visit the tabletop exhibits at this year's conference! Many of the
industry's top suppliers will be showcasing their products and services
during the conference breaks, lunches and reception. Admittance to the
exhibits is included in any conference registration.
If you are interested in exhibiting, contact Nilda Mendez at 847-790-5329 or
by email at: [log in to unmask] for a tabletop exhibit application.
Hotel Information
Both the workshops and conference will be held at the Grand Hyatt Taipei,
Taipei Taiwan, No. 2 Sung Shou Road, Taipei, Taiwan. Rooms are available at
the hotel for a special IPC/JEDEC room rate of NT$5,330+ single
(approximately $152 US), NT$5,830+ double (approximately $166 US) per night.
For reservations, please contact the hotel at 886-2-2720-1200. Rooms and
rate are subject to availability after November 16, 2002, so please make
your reservations early.
CONFERENCE INFORMATION (Professional Development Course Descriptions are
below)
International Conference On Lead-Free Electronic Components and Assemblies
Wednesday/Thursday December 10/11, 2002
Challenges in Adopting Pb-free Interconnects for "Green" Electronics
Dr. Michael Pecht
CALCE Electronic Products and System Center
University of Maryland-College Park, MD, USA
Lead free Technical Issues
K.F. Wong
Redring Solder (M) Sdnbhd
Selangor, Malaysia
Lead-free Soldering Technology
Anita Choo Henkel ( Malaysia )
Sdn Bhd-Perak
Malaysia
Lead-Free Matte Sn Termination for Lead Frame Packages
Achut Kumar
Intel Corporation
Chandler, AZ, USA
Electroplating of Lead-free Tin Alloys
Dr. Manfred Jordan
Dr. Ing. Max Schlötter
GmbH & Co. KG
Geislingen/Steige Germany
Qualification of Pure Matte Tin as an Alternative for Tin Lead
Arlene V. Layson
NS Electronics Bangkok
Bangkok Thailand
Metallurgy and Stability of the Pure Sn/Ni and Sn/Cu Interface for Lead-free
Flip Chip Application
Professor Raymund W.M. Kwok
The Chinese University of Hong Kong
Hong Kong
Lead-Free Plating on Integrated Circuit
Anocha Sriyarunya
AMD(Thailand) Ltd.- Pakkred
Nonthaburi Thailand
Whisker Formation Study of Lead-free Plated Packages
Jeffrey Lee
Advanced Semiconductor Engineering, Inc.
Kaohsiung, Taiwan, R.O.C.
Tin Whiskers: Their Appearance, and Reduction in Electronic Connectors
Dr. Sudarshan Lal, FCI
Etters, PA, USA
Whisker Free Solution
Dr Helmut Bruckner
UNICRON GmbH
Kirchheimbolanden, Germany
Whisker Growth: The Substrate Effect and Beyond
Yun Zhang
Technic Plainview,
NY USA
Lead free Motherboard Assembly at Intel-Lessons Learned
Dr. Tao Liu
Intel
Hillsboro, OR, USA
Lead-free Package Reliability
Jeffrey Lee
Advanced Semiconductor Engineering, Inc
Kaohsiung, Taiwan, R.O.C.
Reliability Evaluation for Lead-free Packages
Dr. Tammy Tzan
Industrial Technology Research Institute
Hsinchu, Taiwan, ROC
EPA/Industry Design for the Environment Program
David Bergman
IPC
JEDEC's Lead-Free Position
Marty Freedman
Molex
IPC's Lead free Position & Status of Lead Free in the U.S.
David Bergman
IPC
EDUCATION COURSES
T-01 (Full Day Course)
Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive
Adhesive Materials
John H. Lau, Agilent Technologies, Inc.
December 9, 2002 8:30 am-4:30 pm
This course gives you fundamental principles, engineering data and cutting
edge information on the most important developments and latest research
results to help you apply the lead-free, halogen-free, and
conductive-adhesives technologies. For professionals involved in
high-density interconnections that demand a cost effective design and
high-yield environmentally benign manufacturing processes, this course is a
timely summary of progress in all aspects.
Topics to be Covered
* Chip (wafer) level interconnects with lead-free solder bumps
* Lead-free solder wafer bumping with microball mounting and paste printing
methods
* Lead-Free solder joint reliability of WLCPs
* Chip (wafer) level interconnects with solderless bumps
* Design, materials, process, and reliability of WLCSPs with solderless
interconnects
* Halogen-free molding compounds
* Environmental issues for conventional PCBs and substrates
* Emerging technologies for fabrication environmental friendly PCBs
* Lead-free legislation and consortia programs
-------------------------------------------------
W:01:
Lead-Free Interconnections-Technology, Selection and Applications
Jennie Hwang, Ph.D., H-Technologies Group, Inc.
December 9, 2002 8:30 am-4:30 pm
Environmental and health concerns have brought about government regulation
restricting lead usage. In addition, the evolution of advanced IC packages
(BGA, CSP, Flip Chip) demand a higher level of performance of solder joints.
Both performance demands and environmental mandates prompt the need for more
knowledge about lead-free solders. This course will provide a clear
understanding of lead-free solders from application perspectives and present
selection criteria for lead-free compositions.
Topics to be Covered
* General introduction of lead and resources
* Legislation status: US, Japan, Europe
* New compositions vs. known binary Sn-Cu, Sn-Bi, Sn-Ag, Sn-Sb, Sn-Zn, and
Sn-In systems
* Pros and cons of various lead-free alloy systems
* Lead-free surface coatings on PCBs and components
* Lead-free solder balls and solder bumping for BGA, CSP, and flip chip
* Differentiation of solder joint failure modes between Sn/Pb and lead-free
* Manufacturing factors: cost vs. performance
* Selection criteria of various lead-free systems and compositions
* Strengthened characteristics of lead-free alloys
* Recommendations to manufacturers
-------------------------------------------------
W-02: Lead-Free PCB Surface Finish & Component Coating
Jennie Hwang, Ph.D., H-Technologies Group
December 9, 2002 1:30 pm - 4:30 pm
The properties and performance of PCB surface finishes and the component
lead coating/terminations are important to the PCB assembly's long-term
integrity as well as to the SMT production yield. This course will provide
attendees a proper level of understanding of the important factors that
determine the solderability and performance of Lead Free surface finishes
and component coatings from both chemical and metallurgical aspects. The
material and process options will be reviewed, and the pros and cons of
various material/process systems from manufacturing perspectives will be
discussed.
Topics to be Covered
*Solderability-principle & definition
*Solderability factors-substrate, chemistry, metallurgy, manufacturing
process
*PCB surface finish-major functions
*PCB surface finish- materials and processes
*Performance of various lead-free metallic systems vs. organic coating vs.
HASL
*Relative performance of lead-free surface finishes with lead-free solder
joints
*Black pad issue
*Tin whisker-phenomena, factors
*The role of gold, palladium, intermetallics in solderability and solder
joints
*Component lead coating/terminations-types
*Lead-free component lead coating/terminations vs. Sn/Pb coated leads
*Recommendations
CLICK HERE TO DOWNLOAD THE BROCHURE AND REGISTRATION FORM:
http://www.ipc.org/LF/LeadFreeConference.htm
All workshop attendees will receive course material, refreshments, and
lunch. All conference registrants will receive conference proceedings,
continental breakfast, and lunch on both days and admission to the tabletop
exhibits and the December 10th reception. Please register by November 15,
2002. For more information or if the registration deadline has passed,
please contact Nancy Feaster at 847-790-5313.
Cancellation Policy: Cancellation received before December 6, 2002 will be
refunded in full. Refunds will not be issued after the start of the program.
Individuals failing to cancel will be billed for the registration fee. If
events are cancelled, participants will receive a full refund. Substitutions
are acceptable.
Download Registration Form in pdf format. Please print out form and fax or
mail.
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the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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