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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 25 Mar 2003 20:44:15 -0600 |
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Hi Joe! Answering your question is as simple as "boiling the ocean"! The
subject of tin whiskers is a huge topic of focus for a number of industry
groups. One good place to start is: http://nepp.nasa.gov/whisker/index.html
. The NASA folks (Jay Brusse specifically) have been a great industry
resource for tin whisker information. Tin whiskers has also been a frequent
topic in the IPC technical conferences too. Good Luck
Dave Hillman
Rockwell Collins
[log in to unmask]
"Macko, Joe @
IEC" <joe.macko To: [log in to unmask]
Sent by: TechNet cc:
<[log in to unmask]> Subject: [TN] component lead plating/tinning
03/25/2003 04:49
PM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to
"Macko, Joe @
IEC"
Fellow Technets,
As the industry moves towards lead-free solder, I am getting a lot of
internal questions regarding the phenomena of tin whiskers and the types of
plating/tinning used on component leads. There is a general concern that
100% tin plated leads may lead to the formation of tin whiskers after board
assembly. I am not that familiar with the phenomena of whisker formation
or the industry standard(s) for plating of component leads but have read
articles that imply that industry is moving towards 100% tin plating on
component leads so they are compatible with leaded and non-leaded solders.
Who can enlighten me on this as well as the formation of tin whiskers?
many
thanks in advance.
joe
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